project picture Process capability Process
Plate type FR4、HTG、Halogen-free, Metal Substrate, High Frequency Plate Paper FR1, fr-2, composite CEM1, CEM3, fr-4, fr-5 (G11) for conventional plate production,
Fr-5 (G11) substrate, PTFE high frequency substrate TUC, ISOLA and ROGERS are selected above the floor of the high-rise board (8) to produce the fan, PI, metal substrate, ceramic substrate, high TG, halogen-free, CTI600 and other special process boards.

surface treatment

Spraying lead and tin, chemical precipitation of gold,

 plug plating of gold, chemical precipitation of tin, 

chemical precipitation of silver, anti-oxidation, 

spraying of pure tin

Match according to customer requirements
Handling hole
  • Through hole, blind hole, buried hole, sunk hole

Match according to customer requirements
Impedance control +/-10% Perform design optimization according to customer impedance requirements, and communicate with EQ if the original design fails to meet impedance requirements
Maximum thickness warp ratio available 10:1 Regular process 8:1, special process up to 10:1
Finished minimum aperture
0.15MM Minimum mechanical drilling 0.15mm
Minimum line width/spacing 3.5MlL/3.5MlL Conventional process 4/4mil, special process can make 3/3mil at least;BGA 0.20 or less
Copper thickness
0.5OZ-12OZ Regular process 1/3oz~3oz, special process up to 12oz
12 layer board 1.5MM-6.4MM Alignment degree between layers ≤3mil, inner hole to line ≤8mil
10 layer board 1.2MM-6.4MM Alignment degree between layers ≤2mil, inner hole to line ≤6mil
8 layer board 1.0MM-6.4MM Interlayer alignment ≤1.5mil, inner hole to line ≤6mil
6 layer board 0.8MM-6.4MM Interlayer alignment ≤1.5mil, inner hole to line ≤6mil
4 layer board 0.4MM-6.4MM Interlayer alignment ≤1.5mil, inner hole to line ≤6mil
Plate thickness/double panel 0.4MM-6.4MM
Maximum machining area 600MM*1000MM
The layer number 2-24layer

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