Process Capability


project
Processing capacity
Detailed process
Diagram
Number of floors
1st to 20th floors
The number of layers refers to the number of layers of the design file. For the time being, only 10 layers or less are accepted, and the website announcement shall prevail.

Sheet type
FR-4-and FR-1-2-3-5, TG1700
FR-1-5, aluminum-based, copper-based, HDi, special materials for soft and hard bonding
Using production technology
FR-4 sheet
Traditional tinning process positive film

Maximum size
500x1100mm
The size of the regular version is 550x420mm, and the size exceeding this size is an extra-long board, and the details are subject to document review.

Solder mask type
Photosensitive ink
Photosensitive ink is the most commonly used type, and thermosetting oil is generally used on low-grade single-sided cardboard. As shown on the right
Copper thickness of finished outer layer
35um/350um (1OZ/2OZ)
Refers to the thickness of the outer circuit copper foil of the finished circuit board, 1 OZ=35um, 2 OZ=70um. The default thickness of the outer copper foil circuit of the conventional circuit board is 1oz, and the maximum can be 2oz (remarks on the order are required). As shown on the right
Finished inner layer copper thickness
17um/70um(0.5 OZ)
Refers to the thickness of the copper foil of the inner layer of the finished multilayer board. The default thickness of the inner copper foil of the conventional circuit board is 0.5oz. As shown on the right

Dimensional accuracy
±0.2mm
<0.2mm, limit +_0.05 price increase delay, CNC shape tolerance ±0.2mm, V-cut board shape tolerance ±0.5mm

Board thickness range
0.2--6.0mm
Current production thickness: 0.2/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.2/2.4/2.6/2.8/3.0/3.2 mm

Board thickness tolerance
(T≥1.0mm)
± 10%
For example, the board thickness T=1.6mm, the actual board thickness is 1.44mm (T-1.6×10%)~1.76mm (T+1.6×10%)

Board thickness tolerance
(T<1.0mm)
±0.1mm
0.7mm(T-0.1)~0.9mm(T+0.1)

Drill hole diameter (mechanical drill)
0.15--6.5mm
0.15mm is the minimum hole diameter of the drill hole, 6.5mm is the maximum hole diameter of the drill hole. If it is larger than 6.3mm, the factory will need to deal with it separately.

Aperture tolerance (machine drill)
±0.08mm
The tolerance of the drilling hole is ±0.08mm. For example, if the hole is designed as 0.6mm, the edge-to-longitudinal ratio of the physical board is 8:1, which is acceptable within 0.52--0.68mm.

Line width
0.08mm
Multilayer board 3.5mil single and double board 5 mil

Line gap
0.08mm Multilayer board 3.5mil single and double board 5 mil

The smallest through hole inner diameter and outer diameter
The minimum inner diameter (hole) is 0.2mm, and the minimum outer diameter (diameter) is 0.45mm
The minimum inner diameter (hole) is 0.2mm, and the minimum outer diameter (diameter) is 0.45mm

Solder Mask Bridge
0.1mm
We are not currently doing solder mask bridges.

Through-hole single-sided solder ring
≥0.153mm (6mil)
If the solder ring on one side of the conductive hole or plug-in hole is too small, but there is enough space there, the size of the solder ring on one side is not limited; if there is not enough space and there are dense wiring, the smallest single side The welding ring shall not be less than 0.153mm

Minimum character width
≥0.15mm
The minimum width of the characters, if it is less than 0.15mm, the physical board may cause unclear characters due to design reasons.

Minimum character height
≥0.8mm
The minimum height of the characters, if it is less than 0.8mm, the physical board may cause unclear characters due to design reasons.

Distance between trace and outline
≥0.3mm (12mil)
For gong board shipment, the distance between the wiring of the circuit layer and the outline line of the board shall not be less than 0.3mm; for V-cut panel shipment, the distance between the wiring and the center line of V-cut shall not be less than 0.4mm

Minimum process edge
3mm


Jigsaw: no gap jigsaw
0 gap fight
It is an imposition shipment, the gap between the middle board and the board is 0 (the document has detailed explanation)

Jigsaw: Jigsaw with gaps
1.6mm
The gap between the gaps and the imposition should not be less than 1.6mm, otherwise it will be more difficult when the gong is on the edge

Minimum hole diameter of half hole process
0.6mm
Half hole process is a special process, the minimum hole diameter shall not be less than 0.6mm

Note 1:
Pads factory copper laying method
Hatch method of copper laying
The manufacturer uses restore copper, customers who use pads for this item, please pay attention to it.

Note 2:
Draw slots in Pads software
Use Drill Drawing layer
If there are more non-metallized grooves on the board, please draw on the Drill Drawing layer

Window layer in Protel/dxp software
Solder layer
A few engineers mistakenly placed the paste layer, Xiaowei does not deal with the paste layer

Protel/dxp shape layer
Use Keepout layer or mechanical layer
Please note: only one shape layer is allowed in a file, and two shape layers are never allowed to exist at the same time. Please delete the unused shape layer, that is: when drawing the shape, you can only choose one of the Keepout layer or the mechanical layer.

Flying probe test

Maximum size 650cmx650cm

Electrical test stand

Maximum size 470cmx470cm


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